Diameter Interop 2007

Organization

• WHAT? Diameter Interoperability Event

Further information regarding agenda, test framework, venue and travel information as well as on-line registration are available at: http://www.diameterinterop.com

• WHEN? 29th January - 2nd February, 2007

• WHERE? Orlando, Florida (hosted by IntelliNet^? Technologies)

• WHO? Companies implementing Diameter, Diameter extensions and Diameter applications

A copy-and-paste from the press announcement: " The Diameter Interoperability Event provides an excellent opportunity for vendors of the Diameter protocol and applications to test their implementations in a friendly setting and get a better understanding of the protocol behavior. Discussions with peers and the experts from DiME^? provide a forum to realize an industry leading implementation. We are expecting a substantial number of participating companies and products, including the base protocol from several vendors as well as a broad range of applications using the protocol. This offers you the opportunity to further refine your own products and assure their interoperability. "

• Please register at http://www.diameterinterop.com

Further information about the interop can be found in the following slide presentation: http://www3.ietf.org/proceedings/06nov/slides/dime-9/sld1.htm

Test Cases

Test cases document is available at -- http://www.opendiameter.org/public/draft-fajardo-dime-interop-test-suite-04.txt

Issue Tracker

The issue tracker can be found here: http://www.tschofenig.com:8080/diameter-interop/index

Meeting Minutes

Meeting minutes by Victor Fajardo:

Here's is a short summary of the Diameter Interop Event that took place on Jan 29 - Feb 1, 2007 (http://www.diameterinterop.com). We also like to thank Intellinet Technologies for hosting the event and making it successful.

Diameter Interop Report Event: Jan 29 - Feb 1 2007

The minutes of the meetings as well as details of the events can be found in http://www.tschofenig.com/twiki/bin/view/Dime/DiameterInterop2007

Participants concentrated on the following tests:

* Base protocol * Diameter Credit control * 3GPP interfaces

Limited testing was done on:

* NASREQ * EAP

Below short list of what was tested. Note that the section numbers correspond to the test suites in http://www.ietf.org/internet-drafts/ draft-fajardo-dime-interop-test-suite-04.txt.

Legend:

(ST) Successful tests (NT) Not tested (but implemented) (NI) Not implemented

A. Base Protocol

3.1.1.1. Capabilities Negotiation ST

3.1.1.2. Election ST

3.1.1.3. Disconnection ST

3.1.1.4. Re-Connection Algorithms ST

3.1.1.5. Failover and Failback ST

3.1.2.1. Peer Based Request Routing ST

3.1.2.2. Realm Based Routing ST

3.1.2.3. Answer Message Routing ST

3.1.2.4. Loop Detection NT

3.1.3. Relay Agent ST

3.1.4. Redirection NT

3.2.1. General Statemachine ST

3.2.2. Dynamic Peer Discovery NT

Not present in the test suite

Duplicate Detection Test NI

TLS ST

SCTP ST

B. Diameter Credit Control and 3GPP Ro Interface

4.2.1.1. Session Based Credit Control First Interrogation ST

4.2.1.2. Session Based Credit Control Intermediate Interrogation ST

4.2.1.3. Session Based Credit Control Final Interrogation ST

4.2.1.4. Sub Sessions NT

4.2.1.5. Session Based Credit Control Failure Procedures ST

4.2.1.6. Service Price Enquiry ST

4.2.1.7. Balance Check ST

4.2.1.8. Direct Debiting ST

4.2.1.9. Refunds ST

4.2.1.10. Event Based Credit Control Failure Procedures ST

4.2.2.1 Tariff Time Support ST

4.2.2.2. Graceful Service Termination NT

4.2.2.3. Validity Time ST

4.2.2.4. Server Initiated Credit Reauthorization NI

4.4.2.1. UDR Sh ST

4.3.3.2. Rf Interface (not using SIP) ST

C. Diameter EAP

4.5.1.1. Non-Roaming case ST

4.5.1.2. Roaming scenario NT

4.5.2. Optional Tests NT

D. Diameter NASREQ

4.6.1.1. Auth Session ST

4.6.1.2. Diameter/RADIUS Gateway NI

4.6.1.3. Multi-domain Scenario NT

4.6.2.1. Auth Session ST

E. Diameter Cx nterface

4.4.1.1 UAR exchange ST

F. Diameter Sh Interface

4.4.2.1. UDR exchange ST

4.4.2.1. PUR exchange ST

G. Diameter Rf Interface

4.4.3.1 Required ST

4.4.3.2 Optional NT

H. Diameter MIP

4.7.1. Generic MIP Test Scenarios NT

4.7.2.1. Co-located Registration NT

4.7.2.2. Intra-Domain Registration NT

4.7.2.3. Inter-Domain Registration NT

4.7.2.4. Allocation of HA in Foreign Network NT

4.7.3.1. Co-located Registration (optional features) NT

4.7.3.2. Inter-Domain Registration with Redirect NT

4.7.3.3. Inter-Domain Registration with Proxy/Relay NT

Some of the participants manage to form a complex topology to test failover and general routing. A pictorial diagram of this tolopogy can be found in: http://www.tschofenig.com/twiki/bin/view/Dime/ToshibaTests The tests performed on this topology is also summarized there.

It was also observed that the test suite document does not cover many of the more detailed cases and it was suggested that we split the document into several test documents such as base protocol test document and a test document for each diameter application.

A summary of issues raised by the participants can be found in: http://www.tschofenig.com:8080/diameter-interop

For general DIME activity, see: http://www.tschofenig.com/twiki/bin/view/Dime

Specifications

The following list shows the specification each company would like to test. It might or might not represent the full list of protocols being implemented.

For the tests the following information is useful:

• Feature (with a reference to the section of the test document) was tested and worked
• Feature was tested and it did not work. Indicating the reason might help. For example: Certificates for TLS could not be created.
• Feature was not tested but it is implemented, for example due to lack of time or interest.
• Feature was not tested because it is not implemented.

Legend:

• Diameter SIP Application: DSIP
• Diameter Mobile IPv4 Application: DMIP
• Diameter NASREQ Application: NASREQ
• Diameter EAP Application: DEAP
• Diameter Credit Control Application: DCC

Participants

-- HannesTschofenig - 01 Feb 2007